EUV Roadmap to 280 Wafers Per Hour and Chips With 0.5 Nanometer Features | NextBigFuture.com
EUV roadmap updated with up to 250wph and 280 wph (wafers per hour) throughput and better overlay (alignment accuracy); probably higher ASPs as productivity improves with each version.
Chips will get to 0.5 Nanometer features in 2030-2032.
– EUV roadmap updated with up to 250wph and 280 wph throughput and better overlay (alignment accuracy); probably higher ASPs as productivity improves with each version pic.twitter.com/zB09eP0j8V
— Sravan Kundojjala (@SKundojjala) November 14, 2024
DUV is the workhorse for ASML and the industry. 525M DUV exposures in CY24 and that will grow to 900M+ by CY30. Updates immersion roadmap. pic.twitter.com/Qxz5eFdlvx
— Sravan Kundojjala (@SKundojjala) November 14, 2024
Brian Wang is a Futurist Thought Leader and a popular Science blogger with 1 million readers per month. His blog Nextbigfuture.com is ranked #1 Science News Blog. It covers many disruptive technology and trends including Space, Robotics, Artificial Intelligence, Medicine, Anti-aging Biotechnology, and Nanotechnology.
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